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Lee Levine

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Technical Articles

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Technical Articles: General

Topic Article Title
Wire Bonding, OptoWire Bonding in Optoelectronics
Wire BondingShould we Pull Test and Shear Test Fine-Pitch Wedge and Ribbon Bonds
Ball BondingPositive Results from a Negative EFO
Wedge BondingThe Ultrasonic Wedge Bonding Mechanism: Two Theories Converge
Wire BondingIntegrated Solutions to Bonding BGA Packages: Capillary Wire and Machine Considerations
Wire Bonding New Trends in Wire Bond Packaging
Wire Bonding How to Optimize and Control the Wire Bonding Process: Part 1 & 2
Ball Bonding Assesing Pad Damage and Bond Integrity for Fine Pitch Probing
Wire Bonding Very Fine Pitch Wire Bonding: Reexamining Wire, Bonding Tool and Wire Bonding Interrelationships for Opyimum Process Capability
Wire Bonding Advanced Ultra-Low-Loop Wire Bonds
Wire Bonding Choosing Capillaries for Fine Pitch Bonding
Wire Bonding Step by Step Wire Bonding

Articles: General | Flip Chip/Bumping | BGA/CSP | Copper | Low K | Reliability | Chinese Language