DECADES OF EXPERTISE
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UNBEATABLE PRICING
Improve yield and increase product reliability
WHO WE ARE & WHAT WE DO
Process Solutions is led by Lee Levine who is an internationally awarded semiconductor assembly process expert with over 30 years of experience in technical process development and optimization.
Lee holds 4 patents and has published more than 70 technical papers. He has received both the John A. Wagnon and the Daniel C. Hughes Awards from the International Microelectronics and Packaging Society (IMAPS) for technical achievements.
Lee spent 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa (The worlds largest manufacturer). He was also a distinguished member of the Technical Staff at Agere Systems.
Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, V.P. of the Keystone Chapter, and V.P. of Technology for IMAPS.
Lee is a graduate of Lehigh University, Bethlehem, PA where he earned a degree in Metallurgy and Materials Engineering.
WHY CHOOSE US
Creative and effective solutions for production process challenges
Enhanced revenue opportunities, higher yields and trouble free operations
Keen analytics and troubleshooting