Publications by Lee Levine (Page1)
Topic | File(.pdf) | Title |
BGA/CSP | ||
| CSI99rv | Bonding Tool Design Choices for Wire Bondable CSP and mBGA Packages | |
| CSR799 | Bonder and Tool Design Choices for CSPs | |
| ITAP98 | Choosing the Correct Capillary Design for Fine Pitch, BGA Packages | |
Cu | copper | Copper: Emerging Material for Wire Bond Assembly |
| Cu40526revb | The Emergence of High Volume Copper Ball Bonding | |
| Cu-wire-bonding | Copper Wire Bonding | |
| ECTC05 | Enhancing Fine Pitch, High I/O Devices with Copper Ball Bonding | |
| ellis | Copper Ball Bonding, An Evolving Process Technology | |
| high_volume_Cu_bonding | The Emergence of High Volume Copper Ball Bonding | |
| IMAPS04Cu | An Update on High Volume Copper Ball Bonding | |
| IMAPS05_Levine_WA6p1 | Copper Ball Bonding for Fine Pitch, High I/O devices | |
| KSCuBallBond ArticleV2 | The Emergence of High Volume Copper Ball Bonding | |
| SemiSing_05Levine | Copper Ball Bonding Advances for Leading Edge Packaging | |
| SW04Cu | The Emergence of High Volume Copper Ball Bonding | |
Flip-Bump | 0409APknsfeature | Stud Bumping and Die Attach for Expanded Flip Chip Applications |
| CSR-7-00 | Comparing Flip-Chip and Wire-Bond Interconnection Technologies | |
| DeepthiIMAPS05 | Gold Stud Bumped Flip Chip: Surface Mounting and Joint Integrity with Thermal Cycling | |
| sw60529a | Ball Bumping and Coining Operations for TAB and Flip Chip | |
| WLP6-20 | Look for Wafer Level Packaging to Rule as the Natural Choice for Opto Packages |